JPH0140197Y2 - - Google Patents
Info
- Publication number
- JPH0140197Y2 JPH0140197Y2 JP17784284U JP17784284U JPH0140197Y2 JP H0140197 Y2 JPH0140197 Y2 JP H0140197Y2 JP 17784284 U JP17784284 U JP 17784284U JP 17784284 U JP17784284 U JP 17784284U JP H0140197 Y2 JPH0140197 Y2 JP H0140197Y2
- Authority
- JP
- Japan
- Prior art keywords
- holder
- sliding
- plunger
- mold
- required number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 8
- 125000006850 spacer group Chemical group 0.000 description 13
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17784284U JPH0140197Y2 (en]) | 1984-11-22 | 1984-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17784284U JPH0140197Y2 (en]) | 1984-11-22 | 1984-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6192055U JPS6192055U (en]) | 1986-06-14 |
| JPH0140197Y2 true JPH0140197Y2 (en]) | 1989-12-01 |
Family
ID=30735415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17784284U Expired JPH0140197Y2 (en]) | 1984-11-22 | 1984-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0140197Y2 (en]) |
-
1984
- 1984-11-22 JP JP17784284U patent/JPH0140197Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6192055U (en]) | 1986-06-14 |
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